Actual TDP may be lower if not all I/Os for chipsets are used. System and Maximum TDP is based on worst case scenarios. Please refer to the Launch Date for market availability. Functionality, performance, and other benefits of this feature may vary depending on system configuration. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. ‡ This feature may not be available on all computing systems. Refer to Datasheet for formal definitions of product properties and features. With a total thermal design power (TDP) of 13 watts, and a lower idle of 5.5 watts, the Intel Q35 Express chipset provides a 50 power savings over the Intel Q965 Express chipset (28 watts TDP). Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction. The updated graphics memory controller hub features a low-power graphics core. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Please contact system vendor for more information on specific products or systems. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.
Read the full Intel® Q35 Express Chipset for Embedded Computing Product Brief.All information provided is subject to change at any time, without notice. Additionally, the ICH9 DO supports Intel® Active Management 3.0 for remote manageability, and Intel® Rapid Recover Technology for data protection. Twelve Hi-Speed USB 2.0* ports and external SATA* (eSATA) port multiplier support on both ICH SKUs provide design flexibility, while Intel® Quiet System Technology regulates system and processor fan speeds for noise reduction. A 1333 MHz system bus supports Intel® processors on 45nm. The I/O controller hub (ICH) is available in two SKUs: Intel® ICH9 and Intel ICH9 DO (digital office). With a total thermal design power (TDP) of 13 watts, and a lower idle of 5.5 watts, the Intel Q35 Express chipset provides a 50% power savings over the Intel® Q965 Express chipset (28 watts TDP). The updated graphics memory controller hub features a low-power graphics core. Intel® 82945GC Graphics and Memory Controller Hub (GMCH) MM 890182. point-of-sale terminals and interactive PCs-, industrial control and automation, gaming, print imaging, and network security applications. Intel® Virtualization Technology for Directed I/O (VT-d) No. technology, the platform helps embedded equipment manufacturers deploy exceptionally responsive, high-performance, low-power systems for interactive clients-i.e. When combined with the Intel® Core™ microarchitecture family of processors on 45nm and 65nm process.
The Intel® Q35 Express Chipset addresses key requirements of many embedded computing designs, including quality graphics, low-power consumption, noise reduction, manageability, data protection, and security. This is an extremely narrow range which indicates that the Intel Q45/Q43 Express Chipset performs superbly consistently under varying real world conditions.
Intel® Q35 Express Chipset for Embedded Computing: Brief The range of scores (95th - 5th percentile) for the Intel Q45/Q43 Express Chipset is just 0.86.